Featured
LCC42
Use Case: 2W & 3W Integrated TFT Cluster
Integrated connected cluster with LTE Cat 1 bis, Wi‑Fi, BLE, GNSS and automotive MCU for digital instrument clusters.
- Automotive MCU
- LTE Cat 1 bis
- Wi‑Fi a/b/g/n
- BLE 5.1 + GNSS
I build secure cloud platforms that connect semiconductor modules to real-world applications — from 2W clusters to smart meters. Focused on AWS IoT Core, TPS/GPS based positioning, OTA updates, and device lifecycle management.
Pioneering the future of connected intelligence
LTSCT is pioneering a new era among fabless semiconductor companies,designing the future of connected intelligence through world-class chip design capabilities. Its high-performance semiconductor solutions help global customers precisely control power, capture and process data, and enable intelligent sensing across mobility, industrial, and energy sectors.
Semiconductor modules powering real-world applications
Featured
Use Case: 2W & 3W Integrated TFT Cluster
Integrated connected cluster with LTE Cat 1 bis, Wi‑Fi, BLE, GNSS and automotive MCU for digital instrument clusters.
Use Case: 2W Cluster & TCU
High-performance LTE Cat 4 smart module with Wi‑Fi, BLE and multimedia for telematics control units.
Featured
Use Case: Dynamic QR Payment Terminal
Dynamic QR Soundbox with LTE Cat 1 bis, Wi‑Fi 6, BLE and RISC‑V MCU for digital payment terminals.
Use Case: Smart Meter, Solar Inverter
LTE Cat 1 bis for IoT/M2M. Reliable, cost-effective 4G with low power for utility applications.
Use Case: POS, Industrial Handheld
Smart LTE Cat 4 module with Wi‑Fi and BLE. High data rates for point-of-sale devices.
Building the bridge between semiconductor modules and cloud applications
Secure identity provisioning server (SIPS) for automated device onboarding with GraphQL APIs and Keycloak authentication.
Cloud-connected AT command server enabling remote diagnostics via MQTT and AWS IoT Core with TLS mutual authentication.
DFOTA update engine with AB partitioning for fault-tolerant updates on QCX216 and QCM2290 platforms.
India Mobile Congress 2026
I'm available all 4 days (7-10 October) for conversations about IoT, cloud infrastructure, and connected device challenges:
Hardware to cloud — building 2W/3W digital instrument clusters
Modernizing 3G/4G telematics with cloud-native IoT architectures
Fault-tolerant firmware updates, AB partitioning for automotive
When to process on-device vs in the cloud for low-latency IoT
Managing device state with intermittent connectivity
Available all 4 days (7-10 Oct) at IMC 2026 • Yashobhoomi, New Delhi
Whether you're exploring IoT cloud architectures, OTA strategies, or connected device challenges — I'd be glad to connect. Let's discuss before IMC ends.